Mediatek Genio 1200 SoC
Mediatek Genio 1200 SoC
Dual display and dual MIPI CSI-2 camera support
Dual display and dual MIPI CSI-2 camera support
Rich wireless connectivity options
Rich wireless connectivity options
Overview
Accelerate the development of groundbreaking systems for demanding industrial, commercial, and consumer edge AI and IoT applications with the VIA SOM-7000 module. Featuring the lightning-fast premium MediaTek Genio 1200 Octa-core SoC, this highly integrated low-power module delivers the blistering AI, graphics, video, and computing performance required for the most demanding industrial, commercial, and consumer AIoT use cases.
Combining Gigabit Ethernet, dual display and dual MIPI CSI-2 camera support with dual-band Wi-Fi 6, Bluetooth 5.2, and optional 4G LTE, the VIA SOM-7000 provides flexible expansion and connectivity options to meet diverse application needs. For the full hardware specifications of the VIA SOM-7000 module and VIA SOMDB7 carrier board, download the following datasheet.
Hardware
VIA SOM-7000 Module
VIA SOMDB7 Carrier Board
The VIA SOM-7000 module is powered by a MediaTek Genio 1200 Octa-Core Processor combining four Cortex-A78 cores running at 2.2GHz and four Cortex-A55 cores running at 2.0GHz with an integrated AI processor providing up to 4.8 TOPS for deep learning, neural network acceleration, computer vision applications and HiFi4 audio processing.
When combined with the VIA SOMDB7 carrier board, the VIA SOM-7000 module provides a wealth of camera and display integration options, including support for two MIPI CSI-2 cameras, a MIPI DSI display, plus, two HDMI and LVDS displays each. High-speed connectivity can be enabled through dual-band Wi-Fi 6, Bluetooth 5.2, two Gigabit Ethernet ports, an integrated SIM card slot, and an M.2 B-Key slot for optional 4G LTE. Two USB 3.1 ports, an ADC/GPIO pin header, an M.2 E-Key slot, and a MicroSD card slot allow additional I/O configuration.
The VIA SOM-7000 module measures 82mm x 80mm (3.22″ x 3.15″) and comes with a two-sided heat spreader. The VIA VAB-912 carrier board is based on an SBC form factor measuring 151mm x 134mm.
Software
VIA SOM-7000 BSP
The VIA SOM-7000 BSP supports Android 13. Software customization services that speed up time to market and minimize development costs are also available.
[1.18 GB] | v1.0.0 | 2024-01-19 |
Get In Touch
The VIA SOM-7000 module can be purchased as a discrete module or together with the VIA SOMDB7 carrier board and optional 4G wireless module. To see how it can be tailored for your specific use cases, contact us for more information!
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Documentation
| Datasheet | 2024-05-08 | |
| User Manual | v1.00 | 2023-09-26 |
| Starter Kit Quick Start Guide | v1.01 | 2023-10-17 |
| STK Android 13.0 EVK Quick Start Guide | v1.00 | 2024-02-29 |
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